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NXP Semiconductors
IP4790CZ38
DisplayPort protection
10. Package outline
TSSOP38: plastic thin shrink small outline package; 38 leads; body width 4.4 mm;
lead pitch 0.5 mm
SOT510-1
D
E
A
X
c
38
y
Z
20
H E
v M A
pin 1 index
A 2
A 1
L
L p
(A 3 )
θ
A
1
19
detail X
e
0
b p
2.5
w M
5 mm
scale
DIMENSIONS (mm are the original dimensions).
UNIT
A
max.
A 1
A 2
A 3
b p
c
D (1)
E (2)
e
H E
L
L p
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.85
0.25
0.27
0.17
0.20
0.09
9.8
9.6
4.5
4.3
0.5
6.4
1
0.7
0.5
0.2
0.08
0.08
0.49
0.21
8
0
o
o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT510-1
IEC
REFERENCES
JEDEC JEITA
MO-153
EUROPEAN
PROJECTION
ISSUE DATE
03-02-18
05-11-02
Fig 4.
IP4790CZ38_1
Package outline SOT510-1 (TSSOP38)
? NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 14 July 2008
6 of 11
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